Improvement of Inverse Solution in Heat Conduction using Laplace Transformation
نویسندگان
چکیده
منابع مشابه
Non-Fourier heat conduction equation in a sphere; comparison of variational method and inverse Laplace transformation with exact solution
Small scale thermal devices, such as micro heater, have led researchers to consider more accurate models of heat in thermal systems. Moreover, biological applications of heat transfer such as simulation of temperature field in laser surgery is another pathway which urges us to re-examine thermal systems with modern ones. Non-Fourier heat transfer overcomes some shortcomings of Fourier heat tran...
متن کاملnon-fourier heat conduction equation in a sphere; comparison of variational method and inverse laplace transformation with exact solution
small scale thermal devices, such as micro heater, have led researchers to consider more accurate models of heat in thermal systems. moreover, biological applications of heat transfer such as simulation of temperature field in laser surgery is another pathway which urges us to re-examine thermal systems with modern ones. non-fourier heat transfer overcomes some shortcomings of fourier heat tran...
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in this paper, we demonstrate the existence and uniqueness a semianalytical solution of an inverse heat conduction problem (ihcp) in the form: ut = uxx in the domain d = {(x, t)| 0 < x < 1, 0 < t t}, u(x, t) = f(x), u(0, t) = g(t), and ux(0, t) = p(t), for any 0 t t. some numerical experiments are given in the final section.
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In the heat conduction problems if the heat flux and/or temperature histories at the surface of a solid body are known as functions of time, then the temperature distribution can be found. This is termed as a direct problem. However in many heat transfer situations, the surface heat flux and temperature histories must be determined from transient temperature measurements at one or more interior...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series B
سال: 2005
ISSN: 0387-5016,1884-8346
DOI: 10.1299/kikaib.71.2523